DIE-BONDING FILM, DICING/DIE-BONDING FILM, METHOD OF MANUFACTURING DIE-BONDING FILM, AND SEMICONDUCTOR DEVICE HAVING DIE-BONDING FILM

摘要

PROBLEM TO BE SOLVED: To manufacture a semiconductor device having an electromagnetic wave shield layer without reducing productivity.SOLUTION: A dicing/die-bonding film comprises: a die-bonding film that has an adhesive agent layer and an electromagnetic wave shield layer consisting of a metal foil; and a dicing film. An attenuation amount of an electromagnetic wave transmitted through the die-bonding film is 3 dB or more at least in a part of a frequency region within a range from 50 MHz to 20 GHz.SELECTED DRAWING: Figure 1