| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which bonds metal members to each other or a metal member to an inorganic member with sound vibration or ultrasonic vibration.SOLUTION: A bonding device has such a constitution that a bonding object member 20 consisting of metal members 21, 22 is compressed by being sandwiched between a first resonator 9 resonating with a first vibrator 12 and a second resonator 16 resonating with a second vibrator 19, vibration in a lateral direction orthogonal to the compression direction is applied from one or both of the first resonator 9 and the second resonator 16 to the bonding object member 20 to bond the metal members 21, 22 to each other, a bonding tool part 10 at the maximum vibration amplitude point of the first resonator 9 and a bonding tool part 17 at the maximum vibration amplitude point of the second resonator 16 correspond to each other in a 1 to 1 manner so as to compress the bonding object member 20 by sandwiching it, and the vibration energy from the bonding tool part 10 and the vibration energy from the bonding tool part 17 act on prescribed portions of the metal members 21, 22 from the upper and lower sides in a concentrative manner to bond the metal members 21, 22.SELECTED DRAWING: Figure 1 |
