| 摘要 |
Provided is a microphone, comprising a metallic cover, and a printed circuit board (PCB) of the microphone that is connected to the metallic cover and is provided with a pickup hole, and further comprising a boss provided with a through hole, wherein the boss is arranged on the face of the PCB facing away from the metallic cover, and the boss is located on a solder pad encircling the pickup hole so as to prevent solder tin and solder flux from entering the pickup hole; and the through hole is in communication with the pickup hole, so that an audio signal passes through the through hole and enters the pickup hole, and when the microphone is welded onto a PCB of a terminal via an oven, solder tin and solder flux flow around the boss and are blocked by the boss, which effectively prevents solder tin and solder flux from entering the pickup hole, thus problems, such as the microphone being silent or noisy are avoided. |
