CARRIER ARRAY AND LIGHT EMITTING DIODE PACKAGE

摘要

A carrier array adapted for carrying a plurality of chips is provided. The carrier array includes a lead frame, controllers and first packages. The lead frame includes a frame body and a plurality of lead frame units. The lead frame units are connected with each other through the frame body and arranged in an array. Each of the lead frame units includes at least one first pin connected with the frame body and a plurality of second pins not connected with the frame body. The controllers are disposed on the lead frame units, and electrically connected with the corresponding lead frame units, respectively. Each of the first packages is disposed on the lead frame, and respectively has an opening to expose a portion region of the corresponding lead frame unit, and the openings are adapted for accommodating the chips. A light emitting diode package is also provided.

主权项

1. A carrier array for carrying a plurality of chips, the carrier array comprising:
a lead frame comprising a frame body and a plurality of lead frame units, wherein the lead frame units are connected with each other through the frame body and arranged in an array, each of the lead frame units comprises at least one first pin connected with the frame body and a plurality of second pins separated from each other, and the second pins are not connected with the frame body; a plurality of controllers disposed on the lead frame units, wherein each of the controllers is electrically connected with one of the lead frame units correspondingly; and a plurality of first packages disposed on the lead frame, wherein the first packages correspond to and encapsulate the lead frame units, each of the first packages has an opening to expose a portion region of the corresponding lead frame unit, and the openings are adapted to accommodate the chips.