| 发明名称 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate. |
| 申请公布号 |
US2016190097(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514817502 |
申请日期 |
2015.08.04 |
| 申请人 |
STMICROELECTRONICS PTE LTD |
发明人 |
LUAN Jing-En |
| 分类号 |
H01L25/065;H01L23/31;H01L25/00;H01L21/56;H01L21/78;H01L23/00;H01L23/498;H01L21/48 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate. |
| 地址 |
Singapore SG |
