| 发明名称 |
WIRING SUBSTRATE |
| 摘要 |
A wiring substrate includes a first substrate and an electronic component mounted on an upper surface of the first substrate. A first pad is formed on an uppermost wiring layer of the first substrate. A connection terminal is formed on the electronic component and is located proximate to the first pad in a plan view. The wiring substrate further includes a connection member formed on the first pad to electrically connect the first pad and the connection terminal. The connection member includes a rod-shaped core and a solder layer, which is coated around the core and joined to the first pad. The solder layer includes a bulge that spreads from the core of the connection member in a planar direction. The bulge is joined to the connection terminal of the electronic component. |
| 申请公布号 |
US2016190053(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514969555 |
申请日期 |
2015.12.15 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MACHIDA Yoshihiro |
| 分类号 |
H01L23/498;H05K1/18;H01L23/00 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring substrate comprising:
a first substrate including an uppermost wiring layer; a first pad formed on the uppermost wiring layer of the first substrate; an electronic component mounted on an upper surface of the first substrate; a connection terminal formed on the electronic component and located proximate to the first pad in a plan view; and a connection member formed on the first pad to electrically connect the first pad and the connection terminal, wherein the connection member includes
a rod-shaped core, anda solder layer coated around the core and joined to the first pad, and the solder layer includes a bulge that spreads from the core of the connection member in a planar direction, the bulge being joined to the connection terminal of the electronic component. |
| 地址 |
Nagano-ken JP |
