| 发明名称 |
CHIP PACKAGE AND A WAFER LEVEL PACKAGE |
| 摘要 |
Various embodiments provide for a chip package consisting of a layer over a carrier, further carrier material over the layer, wherein one or more portions of the further carrier material is removed, and a chip with one or more contact pads, where the chip is adhered to the carrier via the layer. A wafer level package consisting of a plurality of chips adhered to the carrier via a plurality of portions of the layer released from the further carrier material is also provided for. |
| 申请公布号 |
US2016190044(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514827361 |
申请日期 |
2015.08.17 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Meyer-Berg Georg |
| 分类号 |
H01L23/495;H01L21/48;H01L25/065;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
a carrier; a layer over the carrier, a further carrier material over the layer, wherein one or more portions of the further carrier material is removed, thereby releasing one or more portions of the layer from the further carrier material; and a chip comprising one or more contact pads, wherein the chip is adhered to the carrier via the layer; wherein the layer and the further carrier material over the layer are comprised of a foil comprising the layer and the further carrier material. |
| 地址 |
Neubiberg DE |
