发明名称 LOW-TEMPERATURE SEALING GLASS FRIT AND METHOD FOR PREPARING COMPOSITE FILLER IN GLASS FRIT
摘要 The invention discloses a lower-temperature sealing glass frit and a method for preparing a composite filler in the glass frit. The lower-temperature sealing glass frit includes a glass powder and a negative thermal expansion composite filler with an adjustable thermal expansion coefficient. The thermal expansion coefficient of the low-temperature sealing glass frit into which the composite material and the glass powder is mixed can be adjustable so that the thermal expansion coefficient of the low-temperature sealing glass frit can match the thermal expansion coefficient of glass substrates packaging an OLED device to thereby improve the yield of the packaged OLED device.
申请公布号 US2016185652(A1) 申请公布日期 2016.06.30
申请号 US201514686564 申请日期 2015.04.14
申请人 Shanghai Tianma AM-OLED Co., Ltd. ;Tianma Micro-Electronics Co., Ltd. 发明人 LI Dandan
分类号 C03C8/24;C08K3/36;C08K3/22;C03C1/00 主分类号 C03C8/24
代理机构 代理人
主权项 1. A glass frit comprising: a glass powder; and a negative thermal expansion composite filler including a plurality of composite materials and having an adjustable thermal expansion coefficient to be selected from a plurality of thermal expansion coefficients corresponding to preset composition ratios among the plurality of composite materials when the composite materials are mixed to form the negative thermal expansion composite filler.
地址 Shanghai CN