| 发明名称 |
METHOD OF MANUFACTURING ELECTRONIC COMPONENT |
| 摘要 |
A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body. |
| 申请公布号 |
US2016189863(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514942768 |
申请日期 |
2015.11.16 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Moon Soo;YOON Jong Sik;AHN Kyung Han;LEE Dong Hwan;CHA Hye Yeon;LEE Jong Ho |
| 分类号 |
H01F41/04 |
主分类号 |
H01F41/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing an electronic component, comprising:
forming a magnetic body in which internal coil parts are embedded; and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body. |
| 地址 |
Suwon-Si KR |
