发明名称 |
METHOD FOR FABRICATING LIGHTLY DOPED DRAIN AREA, THIN FILM TRANSISTOR AND ARRAY SUBSTRATE |
摘要 |
Embodiments of the disclosure provide a method for fabricating a lightly doped drain area, a thin film transistor, and a thin film transistor array substrate. In an embodiment of the disclosure, a poly-silicon layer, a gate insulation layer, and a gate metal layer are formed in sequence on a substrate; the gate metal layer is patterned to form a gate electrode; the gate insulation layer is etched to form a stepped structure, wherein a width of the gate electrode is smaller than a width of the stepped structure, and an edge of the stepped structure is not covered by the gate electrode; and the poly-silicon layer is doped by an ion doping process using the gate electrode and the gate insulation layer with the stepped structure as a mask to form both a lightly doped area and a heavily doped area. |
申请公布号 |
US2016190284(A1) |
申请公布日期 |
2016.06.30 |
申请号 |
US201514815526 |
申请日期 |
2015.07.31 |
申请人 |
Shanghai Tianma AM-OLED Co., Ltd. ;Tianma Micro-Electronics Co., Ltd. |
发明人 |
Xu Qiong;Zhang Jianjun |
分类号 |
H01L29/66;H01L27/12;H01L29/78;H01L29/786 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating a lightly doped area, the method comprising:
forming a poly-silicon layer, a gate insulation layer, and a gate metal layer in sequence on a substrate; patterning the gate metal layer to form a gate electrode; etching the gate insulation layer to form a stepped structure, wherein a width of the gate electrode is smaller than a width of the stepped structure, and an edge of the stepped structure is not covered by the gate electrode; and doping the poly-silicon layer by a doping process using the gate electrode and the gate insulation layer with the stepped structure as a mask to form a lightly doped area and a heavily doped area. |
地址 |
Shanghai CN |