SUBSTRATE FOR PRINTED WIRING BOARDS AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED WIRING BOARDS

摘要

A substrate for printed wiring boards according to one embodiment of the present invention is provided with: a base film having insulating properties; and a metal layer that is laminated on at least one surface of the base film. A plurality of fine particles are interposed between the base film and the metal layer, and the fine particles are formed of a metal that is the same as the main metal of the metal layer or a metal compound thereof. It is preferable that the plurality of fine particles have an average particle diameter of from 0.1 nm to 20 nm (inclusive). It is preferable that the plurality of fine particles are composed of a metal oxide or a metal hydroxide. It is preferable that the plurality of fine particles are present between the base film and the metal layer in the form of a layer. It is preferable that the metal layer contains a metal grain layer that is formed by firing metal nanoparticles.