ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

摘要

An anisotropic conductive film which is able to be used for fine-pitch FOG connection or COG connection, and which is capable of suppressing increase in the production cost due to increase of the conductive particle density. This anisotropic conductive film comprises an insulating adhesive layer and conductive particles arranged in the insulating adhesive layer. This anisotropic conductive film has conductive particle arrangement regions that are arranged corresponding to the arrangement of terminals of an electronic component to which the anisotropic conductive film is connected. The conductive particle arrangement regions are periodically formed in the longitudinal direction of the anisotropic conductive film. In addition, this anisotropic conductive film has a buffer region, where conductive particles are not arranged, between every adjacent conductive particle arrangement regions for connection.