发明名称 |
GLASS SYSTEM FOR HERMETICALLY CONNECTING CU COMPONENTS, AND HOUSING FOR ELECTRONIC COMPONENTS |
摘要 |
An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass. |
申请公布号 |
EP2683667(B1) |
申请公布日期 |
2016.06.29 |
申请号 |
EP20120711757 |
申请日期 |
2012.03.05 |
申请人 |
SCHOTT AG |
发明人 |
HETTLER, ROBERT;RINDT, MATTHIAS |
分类号 |
C03C8/20;H01L33/48;H01L33/64 |
主分类号 |
C03C8/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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