发明名称 |
WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD |
摘要 |
A method for temporarily bonding a wafer to a support via a temporary bonding arrangement is provided. The arrangement is a composite temporary adhesive layer consisting of a non-silicone thermoplastic resin layer (A) which is releasably bonded to the wafer, a thermosetting siloxane polymer layer (B) laid thereon, and a thermosetting siloxane-modified polymer layer (C) releasably bonded to the support. The method comprises the steps of providing a wafer laminate having a thermosetting silicone composition layer (B') formed on the resin layer (A) which has been formed on the wafer, providing a support laminate having a siloxane-containing composition layer (C') formed on the support, joining and heating layer (B') and layer (C') in vacuum for bonding and curing the layers together. |
申请公布号 |
EP3038148(A1) |
申请公布日期 |
2016.06.29 |
申请号 |
EP20150201534 |
申请日期 |
2015.12.21 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
YASUDA, Hiroyuki;SUGO, Michihiro;TAGAMI, Shohei;TANABE, Masahito |
分类号 |
H01L21/683;B24B37/30;C09J7/02 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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