WAFER STRUCTURE AND METHOD FOR WAFER DICING

摘要

A semiconductor die comprises a main body, protrusion portions, and bonding pads. The main body includes a sidewall. The protrusion portions horizontally protrude from the sidewall respectively. The bonding pads are arranged on the protrusion portions respectively. A wafer dicing method comprises the following steps. Chips are formed on a semiconductor wafer. The bonding pads are formed on boundary lines between every two adjacent chips. A scribe line is formed and arranged along the bonding pads. A photolithographic pattern is formed on an upper surface of the semiconductor wafer to expose the scribe line. The scribe line is substantially etched up to a depth inside the semiconductor wafer under the upper surface to form an etched pattern. A rear surface of the semiconductor wafer thins until the etched pattern of the wafer substrate is exposed.