| 摘要 |
PROBLEM TO BE SOLVED: To provide a die pickup device and a die pickup method capable of precisely recognizing a die position of a wafer immediately after replacing.SOLUTION: A die pickup device includes a recognition processing device recognizing a positioning mark of a wafer, correcting the position of the wafer set at a wafer table immediately after replacing the wafer on the basis of a position of the recognized positioning mark, and obtaining a position for starting the pickup of a die on the basis of the corrected position, and picks up the die of the wafer immediately after replacing on the wafer table. The recognition processing device recognizes a wafer ID mark on the wafer immediately after replacing, calculates a position deviation amount between the position of the recognized wafer ID mark and mapping data, and starts the pickup of the die from a pickup starting point of the wafer immediately ater replacing from the mapping data, when the calculated position deviation amount is less than a predetermined value. |
