发明名称 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection, which has sufficient light reflectance and moldability and is excellent in thermal discoloration resistance, substrate for mounting an optical semiconductor element using the same and a method for producing the same, and an optical semiconductor device.SOLUTION: The thermosetting resin composition for light reflection contains an epoxy resin, a hardener and a white pigment, and includes, as the epoxy resin, at least an epoxy resin represented by general formula (1). [In the formula, each of R, R, Rand Rindependently represents hydrogen atom, 1-4C alkyl or halogen atom, and n represents a number of 0-40].
申请公布号 JP5942445(B2) 申请公布日期 2016.06.29
申请号 JP20120018689 申请日期 2012.01.31
申请人 日立化成株式会社 发明人 小谷 勇人;浦崎 直之;松野 達也
分类号 C08G59/30;C08K3/22;C08K7/24;C08L63/00;H01L23/02;H01L23/08 主分类号 C08G59/30
代理机构 代理人
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