发明名称 A LIGHT EMITTNG DEVICE PACKAGE
摘要 Provided is a light emitting device package which can prevent discoloration and corrosion of a lead frame, and can improve heat radiation efficiency. According to an embodiment of the present invention, the light emitting device package comprises: a package body; at least one lead frame arranged in the package body; a first diamond like carbon (DLC) layer arranged on an upper surface of the lead frame; and a light emitting device arranged on the first DLC layer. A thermal conduction rate of the first DLC layer is higher than the thermal conduction rate of the lead frame.
申请公布号 KR20160075102(A) 申请公布日期 2016.06.29
申请号 KR20140184641 申请日期 2014.12.19
申请人 LG INNOTEK CO., LTD. 发明人 KWACK, HO SANG
分类号 H01L33/62;H01L33/64 主分类号 H01L33/62
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