| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic module that solves various problems caused by flux cleaning and eliminates the need for the flux cleaning, and are highly reliable, and to provide a method of manufacturing the electronic module. <P>SOLUTION: The electronic module includes a substrate which has, on the same surface side, wiring patterns having a first land and a second land, a surface-mounted passive element component mounted on the first land of the substrate via a connection member, a semiconductor chip having a functional surface with a terminal pad and provided on the substrate with the functional surface directed to the side on the opposite side from the substrate, and a bonding wire for electrically connecting the terminal pad of the semiconductor chip to the second land of the substrate, wherein the connection member has a conductive part with a porous structure and a resin part filling a gap formed with the porous structure of the connection part. <P>COPYRIGHT: (C)2010,JPO&INPIT |
