发明名称 パフォーマンスおよび電力のために構成可能な3Dメモリ
摘要 A 3D memory that is configurable for performance and power. An embodiment of a memory device includes a dynamic random-access memory (DRAM) including multiple memory dies, each memory die including multiple memory arrays, each memory array including peripheral logic circuits and a configurable logic. The memory device further includes a system element coupled with the DRAM, the system element including a memory controller. The memory controller is to provide for control of the configurable logic to provide for separate or shared peripheral logic circuits for one or more memory arrays, the configurable logic being configurable to enable or disable one or more of the peripheral logic circuits and to enable or disable one or more I/O connections between the memory arrays.
申请公布号 JP5940735(B2) 申请公布日期 2016.06.29
申请号 JP20150533046 申请日期 2013.06.11
申请人 インテル・コーポレーション 发明人 サラスワット、ルチル;グリース、マティアス
分类号 G11C11/401 主分类号 G11C11/401
代理机构 代理人
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