| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning device which can further inhibit the occurrence of development defects.SOLUTION: A processing procedure unit U1 comprises: a rotation holding unit 20 for rotating a wafer W and liquid nozzles h2-h5 for discharging cleaning liquid onto a surface Wa of the wafer W. At an arrival point on the surface Wa of the wafer W where the cleaning liquid discharged from the liquid nozzles h2-h5 arrives, a current direction of the cleaning liquid is set to be in a direction matching a linear speed direction of the wafer W. During the rotation of the wafer W and while the liquid nozzles h2-h5 are moving from a center side to a peripheral side of the wafer W, a discharging speed of the cleaning liquid discharged from the liquid nozzles h2-h5 is controlled so that a difference between a flow rate of the cleaning liquid at the arrival point and a linear speed of the wafer W at the arrival point falls within a predetermined range. |
