CHIP HEAT DISSIPATION STRUCTURE AND TERMINAL DEVICE

摘要

The present invention provides a chip heat dissipation structure, where the chip heat dissipation structure is disposed on a printed circuit board (PCB), where the chip heat dissipation structure includes a chip card holder and at least one isolation groove; the chip card holder and the PCB are molded into one body; and the at least one isolation groove is disposed on the PCB and located around the chip card holder, and the at least one isolation groove is configured to isolate an area in which the chip card holder is located from another area on the PCB. The present invention further provides a terminal device.