| 摘要 |
The present invention provides a polyamide resin composition containing:
(A) a polyamide resin;
(B) an aluminic acid metal salt; and
(C) at least one or more compounds selected from the group consisting of the following (C1) to (C3):
(C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table,
(C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and
(C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and
wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3), and
the components (C1) to (C3) have the following contents:
component (C1): 0.001 to 0.05 parts by mass in terms of the amount of the metal element,
component (C2): 0.8 to 20 parts by mass, and
component (C3): 1 to 50 parts by mass. |
