| 摘要 |
A light emitting diode package mounting apparatus comprises a heatsink defining a surface comprising one of a male or female connector. An LED package has a base where a portion of the base defines the other of the female or male connector. The connectors engage one another such that a force is exerted on the base that presses the LED package against the surface. To assemble the LED package in the heat sink, the LED package is located on the surface. The LED package and heatsink are moved relative to one another such that the male connector is inserted into the female connector. |
