SENSOR ARRAY PACKAGING SOLUTION

摘要

A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

主权项

1. A sensor array packaging system, comprising:
a structural core body comprising a predetermined configuration on a surface thereof and a through hole extending from the surface to a backside thereof; one or more electro-optical components mounted to the backside of the structural core body; and a wiring board comprising a plurality of sensor array elements contacting walls of the predetermined configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.