发明名称 |
MULTILAYER MOLDING |
摘要 |
A resin-made multilayer molding includes two or more resin layers, at least one resin layer is configured from a mixed resin (B) containing, at a ratio (C)/(D)=99/1 to 10/90 by weight, a polyamide resin (C) obtained by polymerizing a diamine component containing 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and a polyester resin (D) containing a dicarboxylic acid unit and a diol unit, 1-80 mol % of the diol unit having a cyclic acetal skeleton; and at least one resin layer in contact with a layer configured from the mixed resin (B) is configured from a resin containing 70 wt % or more of a thermoplastic polyester resin (A) obtained by polymerizing a dicarboxylic acid component containing 80 mol % or more of terephthalic acid and a diol component containing 80 mol % or more of ethylene glycol. |
申请公布号 |
US2016176170(A1) |
申请公布日期 |
2016.06.23 |
申请号 |
US201414909290 |
申请日期 |
2014.08.07 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
SATO Kazunobu;IWASAKI Atsuko;MIYABE Takanori;SUNADA Tomoe;ARAI Hirokatsu |
分类号 |
B32B27/36;B32B1/02;B65D1/02;B29C49/22;B29C49/04;B32B27/34;B29C49/06 |
主分类号 |
B32B27/36 |
代理机构 |
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代理人 |
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主权项 |
1. A resin-made multilayer molding including two or more resin layers, wherein at least one resin layer of the multilayer molding is configured from a mixed resin (B) containing, at a ratio (C)/(D)=99/1 to 10/90 by weight, a polyamide resin (C) obtained by polymerizing a diamine component containing 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and a polyester resin (D) containing a dicarboxylic acid unit and a diol unit, 1 to 80 mol % of the diol unit having a cyclic acetal skeleton; and at least one resin layer in contact with a layer configured from the mixed resin (B) is configured from a resin containing 70 wt % or more of a thermoplastic polyester resin (A) obtained by polymerizing a dicarboxylic acid component containing 80 mol % or more of terephthalic acid and a diol component containing 80 mol % or more of ethylene glycol. |
地址 |
Tokyo JP |