| 摘要 |
A heat dissipation device (10), a circuit board, and a terminal. The heat dissipation device (10) is applied to a circuit board (20) and comprises a heat dissipation tube (101) and a shielding cover (102). The heat dissipation tube (101) is fixed on the circuit board (20) and surrounds heating components on the circuit board (20). The shielding cover (102) covers the heat dissipation tube (101). The heat dissipation tube (101) is a totally enclosed tube body that is internally provided with a vacuum cavity. The inner wall of the tube body is provided with a liquid adsorption core (101a). A liquid (101b) used to transfer heat is adsorbed in the liquid adsorption core (101a). |
