发明名称 |
FLEXIBLE PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE COMPRISING SAME, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
Provided are a flexible printed circuit board, an electronic device comprising the same, and a method for manufacturing a flexible printed circuit board. The flexible printed circuit board comprises: a base film including a bending region, a first region and a second region, wherein the bending region is disposed between the first region and the second region; a first conductive wiring which is formed on one side of the base film; a first protective layer which is formed on the first conductive wiring, and includes the bending region of the base film; a first conductive layer which is formed on the first conductive wiring where the first protective layer is not formed; and a second protective layer which is formed on the first conductive layer and the first protective layer. |
申请公布号 |
WO2016099011(A1) |
申请公布日期 |
2016.06.23 |
申请号 |
WO2015KR10354 |
申请日期 |
2015.10.01 |
申请人 |
STEMCO CO., LTD. |
发明人 |
LIM, JAE JOON;SON, DONG EUN;JUNG, JIN WOOK |
分类号 |
H05K1/02;H05K3/28 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|