| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of processing the peripheral portion of a substrate in a short time, while coping even with a case where the content of processing is different on the opposite sides of the substrate.SOLUTION: A substrate processing apparatus includes rotary means 2 for rotating a substrate W about an axis of rotation AX perpendicular to the principal surface thereof, a light source 49 outputting laser light L, light branch means 41 for creating a first light beam L1 and a second light beam L2 by branching the laser light, first optical path adjustment means 42 for making the first light beam impinge on the peripheral portion Pw of the substrate along the first incident direction having a component directing from the first principal surface Sa toward the second principal surface Sb of the substrate, and second optical path adjustment means 43 for making the second light beam L2 impinge on the peripheral portion Pw of the substrate along the second incident direction having a component directing from the second principal surface Sb toward the first principal surface Sa, by changing the direction of travel of the second light beam L2. Power ratio of the first light beam L1 and second light beam L2 can be changed.SELECTED DRAWING: Figure 1 |
