PASTY METAL PARTICLE COMPOSITION, BONDING METHOD AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a pasty metal particle composition that is excellent in shape retention after coating while suppressing separation of sinterable metal particles and a volatile dispersion medium, to provide a bonding method capable of easily forming a strong and stable bond between metallic members and to provide an electronic device in which a semiconductor element and a lead frame or a circuit board are stably bonded.SOLUTION: The pasty metal particle composition 2 is a pasty product comprising heat-sinterable metal particles having an average particle size of 0.01 to 10 μm, a low-viscosity volatile dispersion medium and a high-viscosity volatile dispersion medium, forms a non-fluid substance having plasticity by volatilizing the low-viscosity volatile dispersion medium upon drying at 25 to 125°C and allows the metal particles to be sintered upon heating at 150 to 400°C. The method for bonding metallic members comprises heating and sintering the pasty metal particle composition 2 between the metallic members. The electronic device is produced by bonding a semiconductor element 3 to a lead frame or a circuit board 1 using the pasty metal particle composition 2.SELECTED DRAWING: Figure 2