| 摘要 |
PROBLEM TO BE SOLVED: To suppress feedback of a signal generated in a semiconductor chip including a high frequency circuit.SOLUTION: A semiconductor chip 1 includes a semiconductor substrate 2, a high frequency circuit 3 provided on the surface side of the semiconductor substrate, and a metal pattern 4 provided on the back side of the semiconductor substrate. Alternatively, a high frequency module 5X includes a semiconductor chip 1 including a semiconductor substrate 2, and a high frequency circuit 3 provided on the surface side of the semiconductor substrate, and a housing 8 having a metal pattern 4 in contact with the back side of the semiconductor substrate. The metal pattern is separated so as to traverse the signal propagation direction of the high frequency circuit.SELECTED DRAWING: Figure 1 |
