PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING

摘要

A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.

主权项

1. A method of forming a structure, said method comprising:
forming a stressor layer atop a base substrate; providing a handle substrate on the stressor layer, said handle substrate comprises as flexible material that has a radius of curvature of less than 30 cm and at least one metallization region, said at least one metallization region of said handle substrate is in contact with a surface of said stressor layer and is in contact with said flexible material of said handle substrate; and removing an upper portion of said base substrate by spilling to provide a structure comprising, from bottom to top, a spalled material portion of said base substrate, said stressor layer and said handle substrate containing said at least one metallization region in contact with said surface of said stressor layer.