METHODS AND APPARATUS PROVIDING THERMAL ISOLATION OF PHOTONIC DEVICES

摘要

Described embodiments include photonic integrated circuits and systems with photonic devices, including thermal isolation regions for the photonic devices. Methods of fabricating such circuits and systems are also described.

主权项

1. A method of forming an integrated circuit, the method comprising:
providing a substrate; forming a temperature-sensitive photonic device above the substrate; forming a heating device above the substrate, wherein the heating device is configured to dissipate heat toward the photonic device; and forming a thermal isolation region in an area of the die neighboring the heating device, wherein the thermal isolation region reduces dissipation of heat from the heating device into the substrate in the direction of the isolation region.