发明名称 METHODS OF FORMING LOW BAND GAP SOURCE AND DRAIN STRUCTURES IN MICROELECTRONIC DEVICES
摘要 Methods of forming a strained channel device utilizing dislocations disposed in source/drain structures are described. Those methods/structures may include forming a source/drain region in a substrate of a device, and forming an alloy in the source/drain region, wherein the alloy comprises a material that decreases a band gap between source/drain contacts and the source/drain regions to substantially zero. The embodiments herein reduce an external parasitic resistance of the device.
申请公布号 US2016181424(A1) 申请公布日期 2016.06.23
申请号 US201314909981 申请日期 2013.09.26
申请人 INTEL CORPORATION 发明人 RIOS Rafael;KOTLYAR Roza;KUHN Kelin
分类号 H01L29/78;H01L29/417;H01L29/66;H01L29/08;H01L29/165;H01L21/02;H01L29/40;H01L29/45 主分类号 H01L29/78
代理机构 代理人
主权项 1. A method of forming a device comprising: forming source/drain regions in a device substrate; alloying the source/drain material of the source/drain regions with an alloy material to reduce its band gap to close to zero; and forming source/drain contacts to couple to the source/drain regions, wherein the small band gap of the alloyed region results in small metal contact resistance.
地址 Santa Clara CA US