发明名称 |
METHODS OF FORMING LOW BAND GAP SOURCE AND DRAIN STRUCTURES IN MICROELECTRONIC DEVICES |
摘要 |
Methods of forming a strained channel device utilizing dislocations disposed in source/drain structures are described. Those methods/structures may include forming a source/drain region in a substrate of a device, and forming an alloy in the source/drain region, wherein the alloy comprises a material that decreases a band gap between source/drain contacts and the source/drain regions to substantially zero. The embodiments herein reduce an external parasitic resistance of the device. |
申请公布号 |
US2016181424(A1) |
申请公布日期 |
2016.06.23 |
申请号 |
US201314909981 |
申请日期 |
2013.09.26 |
申请人 |
INTEL CORPORATION |
发明人 |
RIOS Rafael;KOTLYAR Roza;KUHN Kelin |
分类号 |
H01L29/78;H01L29/417;H01L29/66;H01L29/08;H01L29/165;H01L21/02;H01L29/40;H01L29/45 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a device comprising:
forming source/drain regions in a device substrate; alloying the source/drain material of the source/drain regions with an alloy material to reduce its band gap to close to zero; and forming source/drain contacts to couple to the source/drain regions, wherein the small band gap of the alloyed region results in small metal contact resistance. |
地址 |
Santa Clara CA US |