发明名称 Vertical ferroelectric memory device and a method for manufacturing thereof
摘要 The disclosed technology generally relates to semiconductor devices, and more particularly to a ferroelectric memory device and a method of manufacturing and using the same. In one aspect, a vertical ferroelectric memory device includes a stack of horizontal layers formed on a semiconductor substrate, where the stack of layers includes a plurality gate electrode layers alternating with a plurality of insulating layers. A vertical structure extends vertically through the stack of horizontal layers, where the vertical structure has a vertical channel structure and a sidewall having formed thereon a vertical transition metal oxide (TMO) ferroelectric layer. A memory cell is formed at each of overlapping regions between the gate electrode layers and the vertical channel structure.
申请公布号 US2016181259(A1) 申请公布日期 2016.06.23
申请号 US201514998227 申请日期 2015.12.23
申请人 IMEC VZW 发明人 Van Houdt Jan;Blomme Pieter
分类号 H01L27/115;G11C11/22;H01L21/28 主分类号 H01L27/115
代理机构 代理人
主权项 1. A vertical ferroelectric memory device, comprising: a stack of horizontal layers formed on a semiconductor substrate, the stack of horizontal layers comprising a plurality gate electrode layers alternating with a plurality of insulating layers; and a vertical structure extending vertically through the stack of horizontal layers, the vertical structure comprising a vertical channel structure and a sidewall having formed thereon a vertical transition metal oxide (TMO) ferroelectric layer, wherein a memory cell is formed at each of overlapping regions between the gate electrode layers and the vertical channel structure.
地址 Leuven BE