发明名称 |
Vertical ferroelectric memory device and a method for manufacturing thereof |
摘要 |
The disclosed technology generally relates to semiconductor devices, and more particularly to a ferroelectric memory device and a method of manufacturing and using the same. In one aspect, a vertical ferroelectric memory device includes a stack of horizontal layers formed on a semiconductor substrate, where the stack of layers includes a plurality gate electrode layers alternating with a plurality of insulating layers. A vertical structure extends vertically through the stack of horizontal layers, where the vertical structure has a vertical channel structure and a sidewall having formed thereon a vertical transition metal oxide (TMO) ferroelectric layer. A memory cell is formed at each of overlapping regions between the gate electrode layers and the vertical channel structure. |
申请公布号 |
US2016181259(A1) |
申请公布日期 |
2016.06.23 |
申请号 |
US201514998227 |
申请日期 |
2015.12.23 |
申请人 |
IMEC VZW |
发明人 |
Van Houdt Jan;Blomme Pieter |
分类号 |
H01L27/115;G11C11/22;H01L21/28 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A vertical ferroelectric memory device, comprising:
a stack of horizontal layers formed on a semiconductor substrate, the stack of horizontal layers comprising a plurality gate electrode layers alternating with a plurality of insulating layers; and a vertical structure extending vertically through the stack of horizontal layers, the vertical structure comprising a vertical channel structure and a sidewall having formed thereon a vertical transition metal oxide (TMO) ferroelectric layer, wherein a memory cell is formed at each of overlapping regions between the gate electrode layers and the vertical channel structure. |
地址 |
Leuven BE |