STACKED SEMICONDUCTOR CHIP RGBZ SENSOR

摘要

An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.

主权项

1. An apparatus, comprising:
a first semiconductor chip having a first pixel array, said first pixel array having visible light sensitive pixels; and, a second semiconductor chip having a second pixel array, said first semiconductor chip stacked on said second semiconductor chip such that said second pixel array resides beneath said first pixel array, said second pixel array having IR light sensitive pixels for time-of-flight based depth detection, wherein, an IR sensitive pixel resides directly beneath one or more of the visible light sensitive pixels such that incident IR light received by the IR sensitive pixel passes through the one or more visible light pixels, and wherein, a light guide structure resides between the one or more visible light pixels and the IR sensitive pixel.