PACKAGE STUCTURE AND METHOD OF FABRICATING THE SAME

摘要

A package structure and a method of fabricating the same are provided. The method includes forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, encapsulating the first wiring layer and the first conductors with a first insulating layer, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, encapsulating the second wiring layer and the second conductors with a second insulating layer, and forming at least one opening in the second insulating layer. The at least one opening extends to a second surface of the first insulating layer, such that at least one electronic component can be disposed in the at least one opening. With forming two insulating layers first followed by forming the at least one opening, there is no need to stack or laminate the substrate that already has an opening, and the electronic component is free of displacement due to any compression. Therefore, a package structure thus fabricated has an increased yield rate.

主权项

1. A package structure, comprising:
a first insulating layer having opposing first and second surfaces; a first wiring layer formed on the first surface of the first insulating layer; a plurality of first conductors formed in the first insulating layer and electrically connected with the first wiring layer; a second wiring layer formed on the second surface of the first insulating layer and electrically connected with the first wiring layer through the first conductors; a plurality of second conductors formed on the second wiring layer; a second insulating layer formed on the second surface of the first insulating layer and encapsulating the second wiring layer and the second conductors, wherein the second insulating layer has at least one opening extending into the first insulating layer, which allows a portion of a surface of the first wiring layer to be exposed from the opening; and at least one electronic component disposed in the opening and electrically connected with the first wiring layer.