| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE |
| 摘要 |
A semiconductor package structure includes a lead frame, a chip and a molding compound. The lead frame includes a tray pad and a plurality of leads. Two of the leads are different in height positions. The chip is disposed on the tray. The molding compound encapsulates the chip and a portion of each lead. |
| 申请公布号 |
US2016181185(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201514747641 |
申请日期 |
2015.06.23 |
| 申请人 |
ALi Corporation |
发明人 |
FENG Lo-Tien |
| 分类号 |
H01L23/495;H01L23/31 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package structure, comprising:
a lead frame, comprising:
a tray; anda plurality of leads, wherein two of the leads are different in height position; a chip disposed on the tray; and a molding compound encapsulating the chip and a portion of each lead. |
| 地址 |
Hsinchu City TW |
