发明名称 THERMAL MITIGATION IN DEVICES WITH MULTIPLE PROCESSING UNITS
摘要 A method of thermal mitigation in a device having a plurality of non-real-time processing units (PUs) and a plurality of real-time PUs, including connecting each of the plurality of real-time PUs and the plurality of non-real-time PUs to a first power supply, and performing thermal mitigation. Performing thermal mitigation includes disconnecting each of the plurality of non-real-time PUs except one of the plurality of non-real-time PUs from the first power supply resulting in an active non-real-time PU, and connecting a second power supply that derives power from the first power supply to the active non-real-time PU, wherein a voltage supplied by the second power supply is less than a voltage supplied by the first power supply.
申请公布号 US2016179180(A1) 申请公布日期 2016.06.23
申请号 US201414579660 申请日期 2014.12.22
申请人 QUALCOMM Incorporated 发明人 Gupta Nikesh;Tiwari Harshit;Bajaj Ashish;Singh Maheshwar Thakur
分类号 G06F1/32 主分类号 G06F1/32
代理机构 代理人
主权项 1. A method of thermal mitigation in a device having a plurality of non-real-time processing units (PUs) and a plurality of real-time PUs, comprising: connecting each of the plurality of real-time PUs and the plurality of non-real-time PUs to a first power supply; and performing thermal mitigation comprising: disconnecting each of the plurality of non-real-time PUs except one of the plurality of non-real-time PUs from the first power supply resulting in an active non-real-time PU; and connecting a second power supply that derives power from the first power supply to the active non-real-time PU, wherein a voltage supplied by the second power supply is less than a voltage supplied by the first power supply.
地址 San Diego CA US