SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT

摘要

The present invention addresses the problem of providing a solder alloy for plating and an electronic component, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass% inclusive and the remainder comprising Sn, and is used in electrical contacts that are electrically connected through mechanical joining.