ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME

摘要

An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

主权项

1. A method of manufacturing an electrical device for soldering to a circuit board with a first solder, the method comprising:
soldering a first lead frame to a multilayer capacitor with a second solder; and modifying a surface portion on the first lead frame, wherein when the electrical device is soldered to the circuit board with the first solder, the surface portion is between a joint formed by the second solder with the circuit board, wherein the surface portion includes one of a physical barrier to a flow of the first solder or an area of reduced wettability with the first solder as compared to the wettability of the first lead frame and the second lead frame with the first solder.