RECONFIGURABLE ELECTRONIC SUBSTRATE

摘要

The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.

主权项

1. An electronic module, comprising:
a first component having a first planar surface; one or more additional components rotatably attached to the first component, wherein each additional component comprises a second planar surface that is generally parallel to the first planar surface in a first configuration of the electronic module and is not parallel to the first planar surface in a second configuration of the electronic module; and a flexible circuit laminated to both the first planar surface and the second planar surfaces, wherein the flexible circuit comprises a first electrical component positioned over the first planar surface and a second electrical component positioned over at least one of the second planar surfaces such that, in the first configuration the first electrical component and the second electrical component are generally parallel to one another and in the second configuration the first electrical component and the second electrical component are not parallel to one another.