| 发明名称 |
PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE ASSEMBLY PAD |
| 摘要 |
A semiconductor device (200) comprising a semiconductor chip (201) has an electrically active side (201a) and an opposite electrically inactive side (201b); the active side bordered by an edge having a first length (202a), and the inactive side bordered by a parallel edge having a second length (202b) smaller than the first length; a substrate has an assembly pad (210) bordered by a linear edge having a third length (210a) equal to or smaller than the first length; the inactive chip side attached to the pad so that the edge of the first length is parallel to the edge of the third length; the active side of the attached chip forms an overhang over the pad, when the third length is smaller than the first length. |
| 申请公布号 |
US2016181180(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414580836 |
申请日期 |
2014.12.23 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Lohia Alok Kumar;Javier Reynaldo Corpuz;Tran Andy Quang |
| 分类号 |
H01L23/495;H01L25/00;H01L23/00;H01L21/78;H01L21/56 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor chip having an electrically active side and an opposite electrically inactive side, the active side bordered by an edge having a first length, the inactive side bordered by a parallel edge having a second length smaller than the first length; a substrate having an assembly pad bordered by a linear edge having a third length smaller than the first length; and the electrically inactive side attached to the pad, wherein the electrically active side of the attached chip forms an overhang over pad. |
| 地址 |
Dallas TX US |
