| 发明名称 |
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties. |
| 申请公布号 |
US2016181140(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414761913 |
申请日期 |
2014.08.18 |
| 申请人 |
DEXERIALS CORPORATION |
发明人 |
MORIYAMA Hironobu;DEGUCHI Shingo;YAGI Hidekazu;ISHIMATSU Tomoyuki |
| 分类号 |
H01L21/683;H01L21/78;H01L23/31;H01L21/304 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A protective tape comprising an adhesive layer, a thermoplastic resin layer and a backing material film layer in that order;
wherein a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. |
| 地址 |
Tokyo JP |
