THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF

摘要

The present invention provides a thermosetting resin composition, comprising thermosetting resin with an unsaturated bond and an alkene compound. In the present invention, an alkene compound with two or more unsaturated bonds such as alkenyl and alkynyl is selected to match thermosetting resin with an unsaturated bond, to obtain a thermosetting resin composition with an excellent dielectric property. On the basis of ensuring the excellent dielectric property, the thermosetting resin composition also has excellent thermal resistance, production and processing properties, and a drilling processability. The thermosetting resin composition in the present invention can be used to prepare a resin sheet material, resin composite tinsel, prepreg, an laminated board, a metal foil-clad laminated board, and a printed wiring board, and can also be used to prepare adhesive and a coating material, and can be further used for the building, aviation, shipping, and automobile industries.