发明名称 DIVIDING DEVICE OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To reduce a push-in quantity of a brake blade when dividing a substrate.SOLUTION: A scribe line S is formed in advance on one glass substrate 11 among two brittle material substrates stuck together by an adhesive layer 12, and a constant width groove 14 is formed on the other silicon substrate 13 along its scribe line S. A break blade 23 is pushed down from the groove 14 side, so that the brake blade 23 contacts with a corner part of the groove 14, and the contact area of the brake blade is reduced, and a push-in quantity is reduced, and a break can be executed.SELECTED DRAWING: Figure 4
申请公布号 JP2016112898(A) 申请公布日期 2016.06.23
申请号 JP20160035418 申请日期 2016.02.26
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MURAKAMI KENJI;TAKEDA MASAKAZU;TAMURA KENTA;KIYAMA NAOYA;HIDESHIMA MAMORU
分类号 B28D5/00;C03B33/033;H01L21/301 主分类号 B28D5/00
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