BENZOXAZINE COMPOUND, BENZOXAZINE RESIN, METHOD OF PRODUCING BENZOXAZINE RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE HEREOF, FRP MATERIAL, SEMICONDUCTOR ENCAPSULATION MATERIAL, VARNISH, CIRCUIT BOARD, PREPREG AND BUILD-UP FILM

摘要

PROBLEM TO BE SOLVED: To provide a benzoxazine compound and a benzoxazine resin each of which provides a cured article excellent in various properties of heat resistance, resistance to pyrolysis, fire retardancy and dielectric property, and to provided a method of producing the benzoxazine resin, a curable resin composition, the cured article thereof, an FRP material, a semiconductor encapsulation material, a varnish, a circuit board, a prepreg and a build-up film.SOLUTION: There is provided the benzooxazine compound obtained by reacting a diamine compound, an aromatic monohydroxy compound, formaldehyde with a phenol compound represented by the formula (I). In the formula (I), X is a substituted/unsubstituted 1,4-phenylene group or 1,4-naphterrylene group.SELECTED DRAWING: None