| 摘要 |
PROBLEM TO BE SOLVED: To provide a boiling cooler capable of preventing a temperature of a semiconductor element from being larger than a heatproof temperature while suppressing reduction in heat transfer rate in a heat sink.SOLUTION: A boiling cooler 10 comprises: a pressure adjustment mechanism 13 for adjusting an internal pressure of a heat sink 11; a temperature sensor 15 for detecting a temperature of a semiconductor element 21; and a pressure controller that drives the pressure adjustment mechanism 13 to reduce the internal pressure of the heat sink 11 before boiling start of cooling medium in the heat sink 11, and that drives the pressure adjustment mechanism 13 to increase the internal pressure of the heat sink 11 when temperature reduction of a predetermined amount is detected as change in temperature of the semiconductor element 21 on the basis of the temperature sensor 15 after energization start to the semiconductor element 21.SELECTED DRAWING: Figure 2 |
