发明名称 MEASUREMENT OF ETCHING MOLECULE LEVEL IN ETCHING COMPOSITION
摘要 A method for identifying the amount of hydrofluoric acid in a buffered oxide etching composition. In buffered oxide etching compositions it is very difficult to measure the amount of hydrofluoric acid because it has varying equilibriums and it is toxic so it hard to handle and sample. When used to manufacture microchips however, incorrect amounts of hydrofluoric acid will ruin those chips. The invention utilizes a unique method of spectrographically measuring the hydrofluoric acid when in contact with added chro mo genie agents to obtain exact measurements that are accurate, immediate, and safe.
申请公布号 WO2016099660(A1) 申请公布日期 2016.06.23
申请号 WO2015US57305 申请日期 2015.10.26
申请人 ECOLAB USA INC. 发明人 TSENG, AMY M.;JENKINS, BRIAN V.;MACK, ROBERT M.
分类号 G01N21/80;B81C1/00;C01B7/19;G01N31/22;G01N35/08 主分类号 G01N21/80
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