| 摘要 |
The purpose of the present invention is to obtain a unit attachment apparatus 100 having a thin profile, as well as excellent countermeasures against the effects of electromagnetic waves and heat on electronic components. The apparatus is provided with: a plate-shaped body 1 having identical cross-sectional shape in a first direction; an opening hole situated in a portion of the plate-shaped body 1; a motherboard 4 mounted to the plate-shaped body 1 so as to define chassis space 3 with respect to a second main surface of the motherboard; and a thermally-conductive, electromagnetic wave absorbent sheet 5 mounted on the back surface of a power semiconductor device 7 which is an electronic component furnished on the second main surface 4B of the motherboard 4, from the opening hole side. The motherboard 4 has a first main surface 4A provided with a unit installation part for installation of an electronic device unit, and a second main surface 4B parallel to the first main surface 4A, and is mounted to the plate-shaped body 1. |
